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Association Connecting Electronics Industries, 03/01/2002
Publisher: IPC
File Format: PDF
$454.00$908.00
Published:01/03/2002
Pages:16
Note:This product is unavailable in Russia, Ukraine, Belarus
Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
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Selection and Application of Board Level Underfill Materials
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Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
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