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Association Connecting Electronics Industries, 07/01/2012
Publisher: IPC
File Format: PDF
$91.00$182.00
Published:01/07/2012
Pages:88
File Size:1 file , 2.6 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
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Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
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Component Identification Training and Reference Guide
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Rework, Modification and Repair of Electronic Assemblies
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Resin Coated Copper Foil for Printed Boards Guideline
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