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Association Connecting Electronics Industries, 01/10/1987
Publisher: IPC
File Format: PDF
$91.00$182.00
Published:10/01/1987
Pages:66
File Size:1 file , 550 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
$91.00 $182.00
Surface Mount Solder Joint Evaluation - Desk Reference Manual
$25.00 $51.00
Requirements for Printed Electronics Functional Conductive Materials
$51.00 $103.00
Specification for Base Materials for High Speed/High Frequency Applications
$71.00 $142.00