IPC HM-860

Specification for Multilayer Hybrid Circuits

Association Connecting Electronics Industries, 01/10/1987

Publisher: IPC

File Format: PDF

$91.00$182.00

Description

Published:10/01/1987

Pages:66

File Size:1 file , 550 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements.

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