IPC J-STD-003

Solderability Tests for Printed Boards

Association Connecting Electronics Industries, 04/01/1992

Publisher: IPC

File Format: PDF

$16.00$33.00

Description

Published:01/04/1992

Pages:15

Note:This product is unavailable in Russia, Ukraine, Belarus

Contains industry-recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated through-holes. Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance.

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