IPC J-STD-003A

Solderability Tests for Printed Boards

Association Connecting Electronics Industries, 02/01/2003

Publisher: IPC

File Format: PDF

$86.00$173.00

Description

Published:01/02/2003

Pages:26

File Size:1 file , 250 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

IPC/EIA J-STD-003A provides industry-recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated-through holes. This revision includes a significant change in the type of flux required to be used for solderability testing. Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance. Produced by IPC and EIA. Supersedes J-STD-003.

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