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Association Connecting Electronics Industries, 01/01/2004
Publisher: IPC
File Format: PDF
$90.00$180.00
Published:01/01/2004
Pages:16
File Size:1 file , 120 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Revision A covers requirements for qualification and classification of rosin, resin, organic and inorganic fluxes according to the activity level and halide content of the fluxes. It includes solder fluxes, flux-containing materials and low residue fluxes for no-clean processes.
Sectional Design Standard for Rigid Organic Printed Boards
$71.00 $142.00
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
$91.00 $182.00
Test Methods for Characterization of Printed Board Assembly Pad Cratering
Printed Board Handling and Storage Guidelines
$48.00 $97.00
