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Association Connecting Electronics Industries, 09/01/2022
Publisher: IPC
File Format: PDF
$90.00$181.00
Published:01/09/2022
Pages:28
File Size:1 file , 2.1 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes.
2000 Market For Electronics Manufacturing Services Providers/Contract Assembly
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Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
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Generic Standard on Printed Board Design, Includes Amendment 1
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Acceptability of Electronic Assemblies
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