IPC J-STD-013

Implementation of Ball Grid Array and Other High Density Technology

Association Connecting Electronics Industries, 08/01/1996

Publisher: IPC

File Format: PDF

$71.00$142.00

Description

Published:01/08/1996

Pages:123

File Size:1 file

Note:This product is unavailable in Russia, Ukraine, Belarus

This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Co-produced with EIA, MCNC and Sematech.

More IPC standard pdf

IPC TR-464

Accelerated Aging for Solderability Evaluations

$71.00 $142.00

IPC D-354

Library Format Description for Printed Boards in Digital Form

$71.00 $142.00

IPC HM-860

Specification for Multilayer Hybrid Circuits

$91.00 $182.00

IPC TR-484

Results of IPC Copper Foil Ductility Round Robin Study

$43.00 $86.00