Your shopping cart is empty!
Association Connecting Electronics Industries, 07/01/2004
Publisher: IPC
File Format: PDF
$48.00$97.00
Published:01/07/2004
Pages:20
File Size:1 file , 120 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Now updated for lead free assembly and rework! This standard identifies the classification level of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. This standard now covers components to be processed at higher temperatures for lead free assembly. It is used to determine what classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment and/or repair operation.
Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX)
$80.00 $160.00
Technical Proceedings for the Designers Learning Symposium - 2001
$57.00 $114.00
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
$71.00 $142.00
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
$50.00 $101.00