IPC J-STD-027

Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

Association Connecting Electronics Industries, 02/01/2003

Publisher: IPC

File Format: PDF

$50.00$101.00

Description

Published:01/02/2003

Pages:20

File Size:1 file , 90 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

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