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Association Connecting Electronics Industries, 04/01/1999
Publisher: IPC
File Format: PDF
$48.00$97.00
Published:01/04/1999
Pages:20
File Size:1 file , 180 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility.
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
$48.00 $97.00
Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
$91.00 $182.00
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
$59.00 $119.00
Rail Transit Addendum to IPC/WHMA-A-620C
$140.00 $281.00
Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
