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Association Connecting Electronics Industries, 04/01/1999
Publisher: IPC
File Format: PDF
$48.00$97.00
Published:01/04/1999
Pages:20
File Size:1 file , 180 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility.
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
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Requirements and Acceptance for Cable and Wire Harness Assemblies
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Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices
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JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
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