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Association Connecting Electronics Industries, 12/01/2022
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/12/2022
Pages:26
File Size:1 file , 2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic devices. This method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility.
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
$43.00 $86.00
Semiconductor Design Standard for Flip Chip Applications
$65.00 $130.00
Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
