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Association Connecting Electronics Industries, 07/01/1994
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/07/1994
Pages:29
File Size:1 file , 210 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Cover and Bonding Material for Flexible Printed Circuitry
$74.00 $148.00
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
$91.00 $182.00
Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
$51.00 $103.00
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
