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Association Connecting Electronics Industries, 01/01/1989
Publisher: IPC
File Format: PDF
$237.00$475.00
Published:01/01/1989
Note:This product is unavailable in Russia, Ukraine, Belarus
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
$50.00 $101.00
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
$48.00 $97.00
Space Applications Electronic Hardware Addendum to Requirements for Soldered Electrical and Electronic Assemblies
$121.00 $242.35
Design Guide for the Packaging of High Speed Electronic Circuits
$71.00 $142.00