IPC SM-780

Component Packaging and Interconnecting with Emphasis on Surface Mounting

Association Connecting Electronics Industries, 03/01/1988

Publisher: IPC

File Format: PDF

$91.00$182.00

Description

Published:01/03/1988

Pages:138

File Size:1 file , 2.5 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start implementation and where to find additional information.