IPC SM-784

Guidelines for Chip-on-Board Technology Implementation

Association Connecting Electronics Industries, 11/01/1990

Publisher: IPC

File Format: PDF

$71.00$142.00

Description

Published:01/11/1990

Pages:37

File Size:1 file , 440 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques.

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