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  • IPC SMC-TR-001

IPC SMC-TR-001

An Introduction to Tape Automated Bonding Fine Pitch Technology

Association Connecting Electronics Industries, 01/01/1989

Publisher: IPC

File Format: PDF

$44.00$88.00


Published:01/01/1989

Pages:54

File Size:1 file , 1.4 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT.

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