• Your shopping cart is empty!

  • IPC SMC-TR-001

IPC SMC-TR-001

An Introduction to Tape Automated Bonding Fine Pitch Technology

Association Connecting Electronics Industries, 01/01/1989

Publisher: IPC

File Format: PDF

$44.00$88.00


Published:01/01/1989

Pages:54

File Size:1 file , 1.4 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT.

More IPC standard pdf

IPC 4552 Amendment 1

IPC 4552 Amendment 1

Amendment 1 to Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

$109.00 $218.26

IPC 4204A

IPC 4204A

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

$67.00 $135.00

IPC 9203

IPC 9203

Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

$91.00 $182.00

IPC 2581

IPC 2581

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

$104.00 $209.16