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Association Connecting Electronics Industries, 12/01/2003
Publisher: IPC
File Format: PDF
$48.00$97.00
Published:01/12/2003
Pages:135
File Size:1 file , 1.4 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision G contains over 500 new or revised terms, including new terminology for ball grid array and chip scale packaging, via protection, lead free solders, assembly processes, base materials and high speed/high frequency boards. Also includes commonly used industry acronyms and an index of terms by technology types for easy searching.
Cleaning Methods and Contamination Assessment for Optical Assembly
$91.00 $182.00
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
$48.00 $97.00
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Guide to Solder Paste Assessment