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Association Connecting Electronics Industries, 10/01/2011
Publisher: IPC
File Format: PDF
$58.00$117.00
Published:01/10/2011
Pages:132
File Size:1 file , 6.9 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
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Printed Wiring Board Strain Gage Test Guideline
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Requirements for Soldered Electrical and Electronic Assemblies
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