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Association Connecting Electronics Industries,
Publisher: IPC
File Format: PDF
$225.00$450.00
Note:This product is unavailable in Russia, Ukraine, Belarus
Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs - Includes addenda I and II
$61.00 $123.00
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
$27.00 $54.00
Guidelines for Chip-on-Board Technology Implementation
$71.00 $142.00
Guidelines for Molded Interconnection Devices
$43.00 $86.00