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Association Connecting Electronics Industries, 04/01/1995
Publisher: IPC
File Format: PDF
$43.00$86.00
Published:01/04/1995
Pages:16
Note:This product is unavailable in Russia, Ukraine, Belarus
Specifications for High Density Interconnect (HDI) and Microvia Materials
$71.00 $142.00
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
$43.00 $86.00
Semiconductor Design Standard for Flip Chip Applications
$65.00 $130.00
Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
