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Association Connecting Electronics Industries, 03/01/1985
Publisher: IPC
File Format: PDF
$43.00$86.00
Published:01/03/1985
Pages:27
Note:This product is unavailable in Russia, Ukraine, Belarus
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
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Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
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Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
Surface Mount Solder Joint Evaluation - Desk Reference Manual
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