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Association Connecting Electronics Industries, 10/01/1989
Publisher: IPC
File Format: PDF
$61.00$123.00
Published:01/10/1989
Pages:110
Note:This product is unavailable in Russia, Ukraine, Belarus
Design and Assembly Process Implementation of 3D Components
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Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
Guideline on Flexibility and Stretchability Testing for Printed Electronics
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Rework, Modification and Repair of Electronic Assemblies
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