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Association Connecting Electronics Industries, 10/01/2021
Publisher: IPC
File Format: PDF
$29.00$58.00
Published:01/10/2021
Pages:20
File Size:1 file , 1.5 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This document introduces design concepts, attributes, and recommendations for the control and mitigation of performance and reliability risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic (E/E) assemblies, including optical and metallic cable and wiring harness assemblies, and elements thereof.
Troubleshooting for PCB Fabrication Processes - Amendment 1
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Design Standard for Printed Electronics on Flexible Substrates
$91.00 $182.00
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
$50.00 $101.00
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
