Your shopping cart is empty!
JEDEC Solid State Technology Association, 11/01/1969
Publisher: JEDEC
File Format: PDF
$29.00$59.00
Published:01/11/1969
Pages:18
File Size:1 file , 320 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)
$28.00 $56.00
TEST PROCEDURE FOR THE MANAGEMENT OF SINGLE-EVENT EFFECTS IN SEMICONDUCTOR DEVICES FROM HEAVY ION IRRADIATION
$43.00 $87.00
ADDENDUM No. 11 to JESD24 - POWER MOSFET EQUIVALENT SERIES GATE RESISTANCE TEST METHOD
$24.00 $48.00
GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING
$25.00 $51.00