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JEDEC Solid State Technology Association, 12/01/2022
Publisher: JEDEC
File Format: PDF
$144.00$289.56
Published:01/12/2022
Pages:30
File Size:1 file , 610 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.
Universal Flash Storage (UFS) Test
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TEMPERATURE, BIAS, AND OPERATING LIFE
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Byte Addressable Energy Backed Interface
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Inspection Criteria for Microelectronic Packages and Covers
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