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JEDEC Solid State Technology Association, 12/01/2022
Publisher: JEDEC
File Format: PDF
$144.00$289.56
Published:01/12/2022
Pages:30
File Size:1 file , 610 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.
WIRE BOND SHEAR TEST
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Material Composition Declaration for Electronic Products
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Glossary of Thermal Measurement Terms and Definitions
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CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
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