• Your shopping cart is empty!

  • JEDEC J-STD-033C

JEDEC J-STD-033C

JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES

JEDEC Solid State Technology Association, 12/01/2011

Publisher: JEDEC

File Format: PDF

$37.00$74.00


Published:01/12/2011

Pages:18

File Size:1 file , 500 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage from the solder reflow process, such as cracks and delamination. This document describes the standardized levels of floorlife exposure for moisture/reflow sensitive SMDs along with the handling, packing, and shipping requirements necessary to avoid moisture/reflow related failures. Companion documents J-STD-020 and J-STD-075 define the classification procedure and JEP113 defines the labeling requirements.

More JEDEC standard pdf

JEDEC JESD220D

JEDEC JESD220D

Universal Flash Storage (UFS)

$177.00 $355.00

JEDEC JESD204C

JEDEC JESD204C

Serial Interface for Data Converters

$152.00 $305.00

JEDEC JESD69C

JEDEC JESD69C

INFORMATION REQUIREMENTS FOR THE QUALIFICATION OF SILICON DEVICES

$27.00 $54.00

JEDEC JESD16B

JEDEC JESD16B

ASSESSMENT OF AVERAGE OUTGOING QUALITY LEVELS IN PARTS PER MILLION (PPM)

$39.00 $78.00