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JEDEC Solid State Technology Association, 12/01/2022
Publisher: JEDEC
File Format: PDF
$119.00$238.01
Published:01/12/2022
Pages:26
File Size:1 file , 1.2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility.
DDR2 SPD INTERPRETATION OF TEMPERATURE RANGE AND (SELF-) REFRESH OPERATION
$25.00 $51.00
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION
$38.00 $76.00
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
$31.00 $62.00
METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESS
$30.00 $61.00
