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JEDEC Solid State Technology Association, 11/01/1972
Publisher: JEDEC
File Format: PDF
$25.00$51.00
Published:01/11/1972
Pages:10
File Size:1 file
Note:This product is unavailable in Russia, Ukraine, Belarus
FOUNDRY PROCESS QUALIFICATION GUIDELINES - BACKEND OF LINE (Wafer Fabrication Manufacturing Sites)
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BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
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