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JEDEC Solid State Technology Association, 05/01/2023
Publisher: JEDEC
File Format: PDF
$127.00$254.29
Published:01/05/2023
Pages:36
File Size:1 file , 440 KB
Note:This product is unavailable in Russia, Belarus
This publication is intended only as a guideline to test facilities in their efforts to establish and maintain consistent PIND testing. Imposition of these suggestions, or any part thereof, is within the province of each test facility as to its respective needs.
THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES
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FULLY BUFFERED DIMM DESIGN FOR TEST, DESIGN FOR VALIDATION (DFx)
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MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES
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APPLICATION SPECIFIC QUALIFICATION USING KNOWLEDGE BASED TEST METHODOLOGY
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