JEDEC JEP122H

Failure Mechanisms and Models for Semiconductor Devices

JEDEC Solid State Technology Association, 09/01/2016

Publisher: JEDEC

File Format: PDF

$81.00$163.00


Published:01/09/2016

Pages:114

File Size:1 file , 2.2 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only available data is based on tests performed at accelerated stress test conditions. The method to be used is the Sum-of-the-Failure-Rates method. This publication also provides guidance in the selection of reliability modeling parameters, namely functional form, apparent thermal activation energy values and sensitivity to stresses such as power supply voltage, substrate current, current density, gate voltage, relative humidity, temperature cycling range, mobile ion concentration, etc.

More JEDEC standard pdf

JEDEC JESD237

JEDEC JESD237

Reliability Qualification of Power Amplifier Modules

$33.00 $67.00

JEDEC JESD8-22B

JEDEC JESD8-22B

HSUL_12 LPDDR2 and LPDDR3 I/O with Optional ODT

$39.00 $78.00

JEDEC JEP153A

JEDEC JEP153A

CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES

$30.00 $60.00

JEDEC JESD246

JEDEC JESD246

Customer Notification Process for Disasters

$25.00 $51.00