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JEDEC Solid State Technology Association, 02/01/2023
Publisher: JEDEC
File Format: PDF
$124.00$248.40
Published:01/02/2023
Pages:14
File Size:1 file , 200 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This document establishes guidelines for integrated circuit unit container and the next level (intermediate) container packing and labeling. The guidelines include tube/rail standardization, intermediate packing, date codes, tube labeling, intermediate container and shipping labels, and standardize tube quantities. Future revisions of this document will also include tray and reel guidelines. The objective of this publication is to promote the standardization of practices between manufacturers and distributors resulting in improved efficiency, profitability, and product quality.
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
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DEFINITION OF THE SSTE32882 REGISTERING CLOCK DRIVER WITH PARITY AND QUAD CHIP SELECTS FOR DDR3/DDR3L/DDR3U RDIMM 1.5 V/1.35 V/1.25 V APPLICATIONS
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TEMPERATURE, BIAS, AND OPERATING LIFE
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HIGH TEMPERATURE STORAGE LIFE
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