JEDEC JEP140 (R2006)

BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES

JEDEC Solid State Technology Association, 06/01/2002

Publisher: JEDEC

File Format: PDF

$27.00$54.00

Description

Published:01/06/2002

Pages:13

File Size:1 file , 72 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards.

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