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JEDEC Solid State Technology Association, 07/01/2002
Publisher: JEDEC
File Format: PDF
$37.00$74.00
Published:01/07/2002
Pages:32
File Size:1 file , 88 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
A Guideline for Defining "Low-Halogen" Solid State Devices (Removal of BFR/CFR/PVC)
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EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
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TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
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IC LATCH-UP TEST
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