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JEDEC Solid State Technology Association, 10/01/2003
Publisher: JEDEC
File Format: PDF
$26.00$53.00
Published:01/10/2003
Pages:11
File Size:1 file , 260 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
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TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
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