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JEDEC Solid State Technology Association, 11/01/2004
Publisher: JEDEC
File Format: PDF
$29.00$59.00
Published:01/11/2004
Pages:17
File Size:1 file , 87 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
WIRE BOND SHEAR TEST
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FAILURE-MECHANISM-DRIVEN RELIABILITY MONITORING
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STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) - LEAD (Pb) CONTENT
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AVALANCHE BREAKDOWN DIODE (ABD) TRANSIENT VOLTAGE SUPPRESSORS
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