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JEDEC Solid State Technology Association, 03/01/2014
Publisher: JEDEC
File Format: PDF
$30.00$60.00
Published:01/03/2014
Pages:20
File Size:1 file , 190 KB
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GUIDELINES FOR THE MEASUREMENT OF THERMAL RESISTANCE OF GaAs FETS
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METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS
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ADDENDUM No. 4 to JESD12 - METHOD OF SPECIFICATION OF PERFORMANCE PARAMETERS FOR CMOS SEMICUSTOM INTEGRATED CIRCUITS
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NUMBERING OF LIKE-NAMED TERMINAL FUNCTIONS IN SEMICONDUCTOR DEVICES AND DESIGNATION OF UNITS IN MULTIPLE-UNIT SEMICONDUCTOR DEVICES
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