Your shopping cart is empty!
PDF Preview
JEDEC Solid State Technology Association, 12/01/2022
Publisher: JEDEC
File Format: PDF
$104.00$208.97
Published:01/12/2022
Pages:28
File Size:1 file , 430 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This publication is intended as a guideline to develop and establish conditions for burn-in and life test of MIL-PRF-38535 QML integrated circuits. These guidelines are intended to provide manufacturers with a consistent means of defining burn-in and life test stress and electrical test requirements acceptable to user organizations and for the development of Standard Military Drawings. The guidelines cover the entire design, wafer fabrication and manufacturing flows, including design and process awareness. Without design awareness (critical circuit blocks/functionality, etc.), burn-in/life test of an integrated circuit might be compromised, or it might dramatically shorten the device’s life prior to system use.
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
$38.00 $76.00
Graphics Double Data Rate (GDDR6) SGRAM Standard
$114.00 $228.00
EXPANDED SERIAL PERIPHERAL INTERFACE (xSPI) FOR NON VOLATILE MEMORY DEVICES, VERSION 1.0
$58.00 $116.00
ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
$33.00 $67.00