Your shopping cart is empty!
JEDEC Solid State Technology Association, 09/01/2015
Publisher: JEDEC
File Format: PDF
$36.00$72.00
Published:01/09/2015
Pages:28
File Size:1 file , 290 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
IC LATCH-UP TEST
$101.00 $202.77
Wire Bond Pull Test Methods
$121.00 $243.60
Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages
$149.00 $299.61
NAND Flash Interface Interopability
$115.00 $231.15