• Your shopping cart is empty!

  • JEDEC JEP167

JEDEC JEP167

Characterization of Interfacial Adhesion in Semiconductor Packages

JEDEC Solid State Technology Association, 04/01/2013

Publisher: JEDEC

File Format: PDF

$36.00$72.00


Published:01/04/2013

Pages:30

File Size:1 file , 280 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.

More JEDEC standard pdf

JEDEC JEP001-1A

JEDEC JEP001-1A

FOUNDRY PROCESS QUALIFICATION GUIDELINES - BACKEND OF LINE (Wafer Fabrication Manufacturing Sites)

$33.00 $67.00

JEDEC JESD22-B113B

JEDEC JESD22-B113B

BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS

$33.00 $67.00

JEDEC JEP131C

JEDEC JEP131C

Potential Failure Mode and Effects Analysis (FMEA)

$36.00 $72.00

JEDEC JESD47K

JEDEC JESD47K

STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS

$38.00 $76.00