• Your shopping cart is empty!

  • JEDEC JEP167

JEDEC JEP167

Characterization of Interfacial Adhesion in Semiconductor Packages

JEDEC Solid State Technology Association, 04/01/2013

Publisher: JEDEC

File Format: PDF

$36.00$72.00


Published:01/04/2013

Pages:30

File Size:1 file , 280 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.

More JEDEC standard pdf

JEDEC JESD224A

JEDEC JESD224A

Universal Flash Storage (UFS) Test

$152.00 $305.00

JEDEC JESD22-A108F

JEDEC JESD22-A108F

TEMPERATURE, BIAS, AND OPERATING LIFE

$27.00 $54.00

JEDEC JESD245B

JEDEC JESD245B

Byte Addressable Energy Backed Interface

$95.00 $191.00

JEDEC JESD9C (R2023)

JEDEC JESD9C (R2023)

Inspection Criteria for Microelectronic Packages and Covers

$138.00 $276.99