JEDEC JEP167A

Characterization of Interfacial Adhesion in Semiconductor Packages

JEDEC Solid State Technology Association, 11/01/2020

Publisher: JEDEC

File Format: PDF

$36.00$72.00

Description

Published:01/11/2020

Pages:32

File Size:1 file , 390 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.

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