• JEDEC JEP170

JEDEC JEP170

Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)

JEDEC Solid State Technology Association, 01/01/2013

Publisher: JEDEC

File Format: PDF

$29.00$59.00


Published:01/01/2013

Pages:18

File Size:1 file , 320 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This publication provides description of defects observed in FCxGA components that can adversely impact end-user products and/or applications. It will also provide illustration on other defects that may be considered visual nonconformities since they should be less disruptive of quality or reliability to customer products. Finally, it will depict a method for visual inspection that can be utilized to identify these defects or visual nonconformities and guidance for disposition. Official criteria for product acceptance should be in actual product drawings and specifications.

More JEDEC standard pdf

JEDEC JESD229-2

JEDEC JESD229-2

WIDE I/O 2 (WideIO2)

$58.00 $116.00

JEDEC JESD22-A120B

JEDEC JESD22-A120B

TEST METHOD FOR THE MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED IN ELECTRONIC DEVICES

$28.00 $56.00

JEDEC JESD22-B109B

JEDEC JESD22-B109B

FLIP CHIP TENSILE PULL

$28.00 $56.00

JEDEC JEP172

JEDEC JEP172

DISCONTINUING USE OF THE MACHINE MODEL FOR DEVICE ESD QUALIFICATION

$30.00 $60.00