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JEDEC Solid State Technology Association, 01/01/2013
Publisher: JEDEC
File Format: PDF
$29.00$59.00
Published:01/01/2013
Pages:18
File Size:1 file , 320 KB
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Characterization of Interfacial Adhesion in Semiconductor Packages
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PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD)
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Temperature Cycling
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Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
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