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JEDEC Solid State Technology Association, 07/01/2014
Publisher: JEDEC
File Format: PDF
$30.00$60.00
Published:01/07/2014
Pages:20
File Size:1 file , 240 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
$39.00 $79.00
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
$31.00 $62.00
1.8 V HIGH-SPEED LVCMOS (HS_LVCMOS) INTERFACE
$24.00 $48.00
CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
$33.00 $67.00