• JEDEC JESD 22-A121A (R2014)

JEDEC JESD 22-A121A (R2014)

MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES

JEDEC Solid State Technology Association, 07/01/2008

Publisher: JEDEC

File Format: PDF

$37.00$74.00


Published:01/07/2008

Pages:31

File Size:1 file , 930 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

The predominant terminal finishes on electronic components have been Sn-Pb alloys. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag. Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.

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