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JEDEC Solid State Technology Association, 09/01/2004
Publisher: JEDEC
File Format: PDF
$27.00$54.00
Published:01/09/2004
Pages:13
File Size:1 file , 36 KB
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METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)
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ADDENDUM No. 2 to JESD35 - TEST CRITERIA FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
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INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD - ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE)
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STANDARD FOR FAILURE ANALYSIS REPORT FORMAT