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JEDEC Solid State Technology Association, 03/01/2023
Publisher: JEDEC
File Format: PDF
$115.00$231.41
Published:01/03/2023
Pages:18
File Size:1 file , 380 KB
Note:This product is unavailable in Russia, Belarus
This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features as reference for specific target implementations of CXL™-attached memory modules. The purpose is to provide certain reference base targets for CXL™-attached memory modules to enable system design simplification, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.
STANDARD FOR DESCRIPTION OF 2.5 V CMOS LOGIC DEVICES
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REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES
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QUALITY AND RELIABILITY STANDARDS AND PUBLICATIONS
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INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - JUNCTION-TO-BOARD
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