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JEDEC Solid State Technology Association, 10/01/2006
Publisher: JEDEC
File Format: PDF
$26.00$53.00
Published:01/10/2006
Pages:11
File Size:1 file , 55 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS
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GDDR5 SGRAM
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Descriptive Designation System for Semiconductor-device Packages
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Characterization of Interfacial Adhesion in Semiconductor Packages
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