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JEDEC Solid State Technology Association, 12/01/2008
Publisher: JEDEC
File Format: PDF
$36.00$72.00
Published:01/12/2008
Pages:27
File Size:1 file
Note:This product is unavailable in Russia, Ukraine, Belarus
3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactions
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TERMS, DEFINITIONS, AND LETTER SYMBOLS FOR DISCRETE SEMICONDUCTOR AND OPTOELECTRONIC DEVICES
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POD15 - 1.5 V Pseudo Open Drain I/O
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EMBEDDED MULTIMEDIACARD (e*MMC) e*MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, INCLUDING RELIABLE WRITE, BOOT, AND SLEEP MODES (MMCA, 4.3)
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