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JEDEC Solid State Technology Association, 07/01/2008
Publisher: JEDEC
File Format: PDF
$31.00$62.00
Published:01/07/2008
Pages:21
File Size:1 file , 660 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES
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INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH
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HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)
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ACCELERATED MOISTURE RESISTANCE - UNBIASED AUTOCLAVE
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