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JEDEC Solid State Technology Association, 01/01/1993
Publisher: JEDEC
File Format: PDF
$40.00$80.00
Published:01/01/1993
Pages:44
File Size:1 file , 1.2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
$31.00 $62.00
METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESS
$30.00 $61.00
CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
$36.00 $72.00
STANDARD TEST LOADS FOR DUAL-SUPPLY LEVEL TRANSLATION DEVICES
$25.00 $51.00